Features of our technology
Can you make something like this? Can you do something like that?
We bring such wishes to life.
At Kyosei, our +ONE solution combines precision processing using photo etching technology with a diverse range of other processes to realize unprecedented and innovative shapes and functions.
Technical details
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Photoetching core technologyWe offer higher precision and higher density processing than anywhere else, thus contributing to the creation of highly competitive products.
- Half-etching
- Large-format etching
- Special metal etching, and more
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Processing technologyUnique shapes that cannot be created by etching alone can be realized via various processing techniques.
- Diffusion bonding & bonding of dissimilar metals
- Laser welding & spot-welding
- Bending processes
- Grinding, cutting, etc.
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Surface treatment technologyWhether for decoration or to improve product quality, you can trust our expertise with all kinds of painting and coating.
- Various types of plating
- Black surfacing & black chrome treatment
- Electrolytic polishing & blasting treatment
- Various types of coating
- Mirror surfacing & paint coating processing etc.
Precision processing
- Processed cross section
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- Processing limits(1)
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- Processing limits(2)
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Thickness (T) | Minimum dimension of D | Practical minimum dimension of D | Practical minimum dimension of W | Precision of DW |
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5〜12.5 ㎛ | Determined by prototyping | Determined by prototyping | Determined by prototyping | Determined by prototyping |
25 ㎛ | ||||
50 ㎛ | ≒ 1.6T | 100 ㎛ | ≒ 0.7T | ± 15㎛ |
100 ㎛ | ≒ T | 150㎛ | ≒ 0.5T | ± 15㎛ |
150 ㎛ | 200 ㎛ | ± 25㎛ | ||
250 ㎛ | 250 ㎛ | ± 40㎛ | ||
500 ㎛ | 500 ㎛ | ± 75㎛ |
If you require a higher level of precision than listed above, please feel free to consult with us.
Bridge shapes
Bridge shapes
In the etching process, a bridge is required to connect the product with the frame. Here we present Kyosei’s standard bridge. Our more customized bridges are not posted here due to intellectual property concerns.
![](/products/images/index/illust_01.jpg)
![](/products/images/index/illust_02.jpg)
![](/products/images/index/illust_03.jpg)
![](/products/images/index/illust_04.jpg)
![](/products/images/index/illust_05.jpg)
![](/products/images/index/illust_06.jpg)
Supported materials
Gold, silver, palladium, pure copper, brass, phosphor bronze, BeCu, nickel silver, copper-titanium alloys, SUS, Hastelloy, Inconel, permalloy, Kovar, tungsten, molybdenum, amorphous metals, aluminum, titanium, magnesium, Alloy 42, iron, nickel, and more.
Major fields of application
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Semiconductor-related componentsSemiconductor test-related components, semiconductor package components, and more.
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Electronics-related componentsPrecision components for automobiles, smartphones, optical devices, and more.
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Decor & interiorInterior and exterior design for shops, commercial facilities, automobiles, etc., as well as interior items and more.