Contactors for semiconductor wafers/package inspection, interposers, lead frames for semiconductor packages, lead frames for MEMS semiconductors (various sensors), carrier trays for semiconductor processing, guide plates for semiconductor package sockets, probe card test heads, guide plates and substrate frames for semiconductor devices, and more.
Etching processes can be used for lead frames. Mass production (quality, cost, delivery times) is available at our Thailand factory. Can also be used for ultra-fine SUS materials as thin as 0.004 mm.
We carry out allocation designs to maximize the number of products handled. Etching in any material form (sheets, rolls) is supported.
Three-dimensional shapes for carrier trays can be handled in-house by joining plates (laser welding). We have a proven record for manufacturing various kinds of trays from bonded products obtained by stacking multiple layers of 3mm SUS material.
As an alternative to resin-drilled products, this can be applied to insulation-treated items for etching workpieces in metal materials. We offer insulated-treated parts as guide plates for thin plate-etched products with multiple holes and narrow pitches. Besides round holes, hex-shaped holes and rectangular holes are also available.
Supports products processed with multiple punch holes and products that require modification to be more lightweight. We offer etching mesh processing with SUS materials changed to aluminum or magnesium.